三星K4ZAF325BC-SC20 16GB GDDR6 20GBPS FBGA图形DRAM芯片
  • 产品分类:内存套件
  • 零件编号:K4ZAF325BC-SC20
  • 库存情况:In Stock
  • 状况:全新
  • 产品特色:准备发货
  • 最小订单:1单位
  • 原价:$39.00
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Title

Samsung K4ZAF325BC-SC20 16Gb GDDR6 20Gbps FBGA Graphics DRAM Chip

Keywords

Samsung K4ZAF325BC-SC20, 16Gb GDDR6, 20Gbps graphics memory, FBGA-180 package, 512M x 32 organization, high speed GPU memory, Samsung graphics DRAM, chip for video cards

Description

The Samsung K4ZAF325BC-SC20 is a high-velocity graphics DRAM (GDDR6) chip designed for modern GPUs, graphics cards, and high-bandwidth rendering applications. It delivers up to **20.0 Gbps** data rate, fulfilling demanding bandwidth requirements for gaming, 3D graphics, video processing, and GPU-accelerated compute tasks.

With a density of **16 Gb** per chip, the organization is 512M x 32, allowing wide data paths and high throughput per chip. Packaged in a compact **180-pin FBGA** format, it is appropriate for high-density board designs in graphics cards and other form-factors where space efficiency is critical. 

Operating voltage is typical for GDDR6: ~1.35 V, which balances performance and power draw. The chip is rated for ambient temperatures from 0 °C to 85 °C—suitable for graphics card use under normal load, but cooling design is important for sustained performance. 

Refresh time is standard 16K / 32 ms, aligning with GDDR6 norms to maintain data integrity. The part is in mass production status, ensuring availability and consistency for designers and manufacturers sourcing graphics memory.

This chip is a popular choice in mid-high tier graphics cards like the RTX 4060 Ti (or equivalents) for VRAM modules, often used as the memory ICs behind the scenes. Its performance makes it a strong candidate when building or selecting video cards with good bandwidth and reliability. 

Key Features

  • 16 Gb per chip GDDR6 density, enabling high-capacity GPU memory modules. 16Gb GDDR6
  • 20.0 Gbps data rate per pin, providing high throughput performance. 20Gbps graphics memory
  • 512M × 32 organization which allows wide data paths for efficient memory access. 512M x 32 organization
  • 180-pin FBGA package for compact mounting on graphics PCB designs. FBGA-180 package
  • Mass production status means good availability and cost-stability. Samsung K4ZAF325BC-SC20
  • Typical operating range 0-85 °C; standard refresh behaviour (16K/32ms) for graphics memory reliability.

Configuration

AttributeSpecification
Part NumberK4ZAF325BC-SC20
Memory TypeGDDR6 SDRAM
Density16 Gb per chip
Organization512M × 32
Speed / Data Rate20.0 Gbps I/O rate
Package180-pin FBGA
Voltage~1.35 V typical
Refresh Interval16 K rows / 32 ms
Operating Temp0 to 85 °C
Production StatusMass Production by Samsung

Compatibility

The K4ZAF325BC-SC20 chip is used in graphics cards or GPUs that require high-speed VRAM modules. It is compatible with designs that support GDDR6 and 180-pin FBGA IC packaging. The host GPU memory controller must support 20.0 Gbps speed and voltage around 1.35 V. 

It is seen in GPUs such as the RTX 4060 Ti (and similar class) where these ICs drive the memory chips on the card. PCB layout, trace impedance, cooling of VRAM, and memory controller timing are critical to achieving advertised speeds without errors. 

Because the chip is not a DIMM but a graphics memory chip (IC), compatibility depends on the graphics card’s architecture — it doesn’t plug into sockets like server RAM; it's soldered onto the PCB. 

Usage Scenarios

1) Graphics Card Manufacturing: Used for producing large-volume graphics cards (e.g., mid-high tier GPUs) needing 8G or more of GDDR6 memory. This chip is one of the building blocks for VRAM modules.

2) GPU Module Repair / Replacement: For repair shops or OEMs replacing faulty VRAM ICs on PCBs where K4ZAF325BC-SC20 is the specified chip.

3) Embedded Graphics / FPGA Boards: On boards needing fast frame buffers, image processing, video rendering or display pipeline buffers—anything that benefits from high-speed GDDR6.

4) Gaming & PC Enthusiasts Overclocking: For GPU models known to use this chip, enthusiasts might tune cooling and power to reach stable 20Gbps operation or better (if the card supports headroom).

5) AI Inference Edge / Edge GPUs: In small form-factor GPUs where high memory bandwidth is required but space is limited; chip’s FBGA footprint helps maintain compact design.

Frequently Asked Questions

  1. Q: Is this chip used directly as “RAM module” like server RDIMM / UDIMM?
    A: No. K4ZAF325BC-SC20 is a GDDR6 IC (graphics DRAM) chip, not a socketed DIMM. It is soldered on graphics card PCBs. It functions as VRAM, not main system RAM.
  2. Q: What kind of voltage and cooling does this chip require to function reliably at 20Gbps?
    A: It runs at ~1.35 V typical; stable performance at 20Gbps requires good PCB trace layout, adequate heatsinking or thermal spreaders to manage VRAM heat especially under load. Cards using this IC often include VRAM thermal pads / cooling materials.
  3. Q: Can this IC be used for overclocking beyond 20Gbps?
    A: Potentially yes, depending on the GPU card’s design, cooling, and voltage overhead. However, exceeding rated speed risks stability issues and may void warranty. Use with caution.
  4. Q: Is this chip reliable for high-bandwidth workloads such as gaming, real-time rendering or AI workloads?
    A: Yes — GDDR6 chips like K4ZAF325BC-SC20 are built for high throughput; in properly designed systems/cards, they deliver consistent performance for gaming, rendering, or memory-intensive tasks. Just ensure the rest of the GPU card (controller, power delivery, cooling) is up to spec.
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